mg Chemicals Non-Silicone Epoxy Mold Release 12.3 oz Aerosol
By A Mystery Man Writer
Last updated 14 Jul 2024
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The 8329 Epoxy Mold Release is a non-silicone release agent that is formulated to prevent epoxies and other thermosetting materials from bonding to metal molds. This release agent was developed specifically for transfer and compression molding. It can be safely used on most types of plastic. It is very efficient at fully penetrating molds and forming a thin, even coat across the mold surfaces. This ensures a clean part release and glossy finish.
It allows for a clean removal of the cured epoxy For use with all types of epoxies and phenolic resins
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MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol
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Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use
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MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release, 12.3 oz
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832TC is a 2-part, black, thermally conductive epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards
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The 8329 Epoxy Mold Release is a non-silicone release agent that is formulated to prevent epoxies and other thermosetting materials from bonding to metal molds. This release agent was developed specifically for transfer and compression molding. It can be safely used on most types of plastic. It is very efficient at fully penetrating molds and forming a thin, even coat across the mold surfaces. This ensures a clean part release and glossy finish.
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mg Chemicals Non-Silicone Epoxy Mold Release 12.3 oz Aerosol
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