New Highly Flexible Silver Conductive Epoxy Adhesive

Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures.

Spec. Gravity 2.32 g/cc Mixed Viscosity 995000 cP at temp 25.0 °C Mechanical Properties Hardness, Shore D 80 Adhesive Bond Strength 90 psi Lap shear 2

Silver Epoxy, Electrically Conductive Adhesive, Highly Flexible Non-Bleeding AA-Duct 2919, 2.5gm kit

EP21TDCSFL Product Information

G6-FXSG is a flexible, two-component, electrically-conductive high-performance adhesive well suited for bonding dissimilar materials that are likely

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This electrically conductive silver epoxy allows for quick, cold-soldering repairs. It is considered a solder replacement epoxy for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. High electrical conductivity Convenient 1 to 1 mix ratio Cures at room temperature SVHC free Long shelf life.

mg Chemicals 8331D-14G Silver Conductive Epoxy